- Home
- Symmetry Blog
- Dual mode BT5 and IEEE 802.15.4 compatible MCU
From Redpine Signals: "Dual mode Bluetooth 5 and IEEE 802.15.4 compatible wireless MCU, Redpine announced"
About Symmetry Electronics
Established in 1998, Symmetry Electronics, a Division of Braemac, is a global distributor of electronic components and systems. Combining premier components and comprehensive value-added services with an expert in-house engineering team, Symmetry supports engineers in the design, development, and deployment of a broad range of connected technologies.
Exponential Technology Group Member
Acquired by Berkshire Hathaway company TTI, Inc. in 2017, Symmetry Electronics is a proud Exponential Technology Group (XTG) member. A collection of specialty semiconductor distributors and engineering design firms, XTG stands alongside industry leaders TTI Inc., Mouser Electronics, and Sager Electronics. Together, we provide a united global supply chain solution with the shared mission of simplifying engineering, offering affordable technologies, and assisting engineers in accelerating time to market. For more information about XTG, visit www.xponentialgroup.com.
Redpine Signals Inc. announced "RS13100", a wireless communication MCU compatible with dual mode Bluetooth 5 and IEEE 802.15.4 (news release). Fitness band, industrial control unit, location tag, battery-powered equipment such as smart lock etc.

According to Redpine, the feature of the new product is low power consumption, and the processing performance can be 2 to 3 times while prolonging the battery life of the equipment by 3 to 4 times. The power consumption of MCU subsystem including Cortex-M4F etc. is 19 μA / MHz when operating in low power mode and 500 nA or less at deep sleep. The current consumed by the wireless communication subsystem is 7.7 mA at the time of 1 Mbit / s transmission in Bluetooth 5 mode and 10.2 mA at reception. It is suppressed to 15 μA in Connected Mode.
The package is 79 balls WLCSP (3.51 mm × 3.6 mm), 84 pin QFN (7 mm × 7 mm), 196 ball BGA (6 mm × 6.3 mm). Besides this, you can also choose a 4.63 mm x 7.9 mm LGA module. The RS13100 is currently shipping samples, and mass production is scheduled to begin in the fourth quarter of 2018. Evaluation kit "RS13100-EVK1" is available. Prices are unpublished.