The Digi ConnectCore® MP1 Family is Empowering Seamless Integration and Smart IoT Innovation
About Jari Haiston
Seamless and secure connectivity is paramount for powering Internet of Things (IoT) innovation. Digi International, a leading provider of embedded connectivity solutions, offers the Digi ConnectCore® MP1 product family as a versatile and reliable solution for a wide range of IoT applications. Based on the STMicroelectronics STM32MP1 MPU family, Digi ConnectCore MP1 provides an intelligent and secure embedded system-on-module (SOM) solution that meets the demands of modern industrial applications. With modules designed to meet diverse industry needs, including the ConnectCore MP15 and MP13, Digi ConnectCore MP1 empowers businesses to harness the full potential of connected devices.
The ConnectCore MP1 family offers turnkey Linux support and comes in the robust Digi SMTplus® standard form factor. At just 29 x 29 mm, this module line offers high reliability and pin-compatibility with Digi ConnectCore 6UL SOMs. In this industrial-grade and scalable platform, the module features pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth® 5.2 for wireless connectivity, as well as power management with hardware and software support. Security is prioritized with built-in Digi TrustFence® device security, identity, and privacy.
Additionally, seamless integration with Digi XBee® cellular and RF modems allows for versatile connectivity options. Digi ConnectCore MP1 supports Digi ConnectCore Cloud Services for remote monitoring, device management, and IoT application enablement. It is backed by Digi Embedded Yocto Linux support, and Digi offers turnkey development services through Digi WDS as well.
Intelligent Connectivity for Secure Devices: ConnectCore MP157 and MP133
The Digi ConnectCore MP157 and Digi ConnectCore MP133 both offer powerful embedded system-on-module solutions, showcasing industrial-grade, scalable platforms with pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.2 connectivity. Despite their similarities, there are distinct differences between the two modules that make them suitable for different use cases.
The MP157 is powered by the STMicroelectronics STM32MP157C microprocessor, which features dual Arm Cortex-A7 and a Cortex-M4 cores, delivering exceptional processing capabilities. This module stands out with its integrated 3D graphics processing unit (GPU) and display interface, making it an ideal choice for advanced human-machine interface (HMI) development. Additionally, the MP157 incorporates Gigabit Ethernet connectivity, ensuring reliable and fast connections. Its high levels of security, reliability, and performance make it specifically designed for demanding industrial and medical applications.
The Digi ConnectCore MP133 is based on STMicroelectronics’ STM32MP13 processor and is designed with a focus on low-power applications while maintaining performance. Like the MP157, it also offers pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.2 connectivity, but it does not include integrated 3D GPU and Gigabit Ethernet. Instead, the strength of the MP133 lies in its compact form factor. The MP133 is ideal for developers seeking a solution for space-constrained designs, yet still require reliability and industrial-grade durability.
When considering the Digi ConnectCore MP157 or ConnectCore MP133 for a design solution, developers should consider the desired capabilities and intended application of their device. If your IoT development requires a robust and powerful solution with advanced graphic capabilities for industrial and medical applications, then the MP157 is the optimal choice. However, if your focus is on low-power IoT innovation in a compact device form factor, the Digi ConnectCore MP133 is a more suitable option.
Digi ConnectCore MP157 and MP133 Key Features:
- 3D GPU, rich display and camera capabilities (Digi ConnectCore MP157 only)
- Industrial-grade, scalable, embedded SOM platform
- Pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.2
- Power management with hardware and software support
- Digi SMTplus form factor (29 x 29 mm) for superior reliability
- High level of pin-compatibility with Digi ConnectCore 6UL SOMs
- Built-in Digi TrustFence device security, identity, and privacy
- Seamless Digi XBee cellular and RF modem integration
- Remote monitoring, device management, and IoT application enablement with Digi ConnectCore Cloud Services
- Digi Embedded Yocto Linux support
- Turnkey development services available from Digi Wireless Design Services
Featured Products
Digi ConnectCore MP1 Development Kits
Digi ConnectCore MP1 development kits provide comprehensive and versatile solutions for developers working with the ConnectCore MP1 SOMs. ConnectCore MP1 development kits offer a complete package to facilitate efficient development and testing of applications based on the MP1 platform. The kits come equipped with all the necessary tools, software, and documentation–enabling developers to quickly prototype, debug, and deploy their solutions. With features like pre-certified wireless connectivity, integrated security mechanisms, and cloud service integration, ConnectCore MP1 development kits empower developers to create robust and secure IoT applications.
Digi ConnectCore MP157 and MP133 Development Kits
The Digi ConnectCore MP157 Development Kit and Digi ConnectCore MP133 Development Kit are both industrial-grade, scalable, embedded SOM platforms designed for secure connected devices in industrial and medical applications. They boast a lifespan of over 10 years, ensuring high levels of security, reliability, and performance. Both development kits feature the Digi SMTplus form factor (29 x 29 mm) for simplified design integration, flexibility, and ultimate reliability.
The Digi ConnectCore MP157 stands out as the world's first development kit with remote capabilities. Powered by the STMicroelectronics STM32MP157C, it’s an intelligent communication engine for advanced HMI development. Its integrated 3D GPU and display interface options make it an optimal platform for advanced graphical applications. The MP157 development kit seamlessly combines Gigabit Ethernet and pre-certified dual-band Wi-Fi 5 with Bluetooth 5 connectivity, providing comprehensive wireless options. It’s a formidable solution for secure embedded devices as it also supports Digi TrustFence device security, identity, and privacy features. Moreover, its compatibility with Digi XBee cellular and RF modems and Digi ConnectCore Cloud Services enables remote monitoring, device management, and IoT application enablement.
The Digi ConnectCore MP133 Development Kit utilizes the STMicroelectronics STM32MP13 microprocessor and still offers pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.2 connectivity. It shares several key features with the MP157, including power management support, Digi SMTplus form factor, pin-compatibility with Digi ConnectCore 6UL SOMs, and built-in Digi TrustFence device security, identity, and privacy features. It also supports Digi ConnectCore Cloud Services for remote monitoring, device management, and IoT application enablement, so it is well-suited for similar applications as the MP157. However, the MP157 stands out for its unique remote capabilities, advanced HMI development potential, and integration of a 3D GPU. The MP133 offers slightly updated Bluetooth connectivity (version 5.2) and may be preferred in scenarios where the specific Bluetooth version matters.
Determine whether your device design would benefit from either the MP157 or MP133 development kits would largely depend on the specific requirements of the project. The Digi ConnectCore MP157 development kit is ideal for applications demanding remote capabilities and advanced graphical processing, while the Digi ConnectCore MP133 development kit is a suitable option for projects where Bluetooth 5.2 is essential or for scenarios where its availability or pricing may be more attractive.
Digi ConnectCore MP157 and MP133 Development Kit Key Features:
- 3D GPU, rich display and camera capabilities (Digi ConnectCore MP157 only)
- Industrial-grade, scalable, embedded SOM platform
- Pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.0
- Power management with hardware and software support
- Digi SMTplus form factor (29 x 29 mm) for ultimate design flexibility
- High level of pin-compatibility with Digi ConnectCore 6UL SOMs
- Built-in Digi TrustFence device security, identity and privacy
- Seamless Digi XBee cellular and RF modem integration
- Digi ConnectCore Cloud Services for remote monitoring, device management and IoT application enablement
- Digi Embedded Yocto Linux support
- Turnkey development services available from Digi Wireless Design Services
Featured Products
Get Started with the Digi ConnectCore MP1 Family
The Digi ConnectCore MP1 product family delivers robust and secure embedded connectivity solutions for a wide range of IoT applications. With their intelligent connectivity, high-performance processors, built-in security features and full suite of tools and services, these modules enable businesses to design and deploy innovative and secure IoT solutions, get to market fast, and manage their deployed products over the complete lifecycle. Whether it's the powerful capabilities of the Digi ConnectCore MP157 module or the compact yet versatile design of the Digi ConnectCore MP133, the ConnectCore MP1 product family offers a scalable and reliable platform to unlock the true potential of connected devices in the IoT era.